News & Events

NEW Process Capability

DLE has recently added UV laser cutting and engraving equipment to our manufacturing capabilities. Our initial equipment is ideal for rapid prototype and small volume production and is suitable for use on tight tolerance and small feature configurations such as capillary designs, flex circuits and PCB masking. With an eye on the future we are collaborating with our custom equipment manufacturer to integrate a reel-to-reel system to allow for high throughput web technology.

NEW Packaging Equipment

Our manufacturing facility has recently installed new foil and poly pouching equipment that will dramatically improve our packaging capability and capacity. The new system can produce 2-across pouching of low profile components up to 100 units per minute and includes various sealing and tear point features. Send us the details on your requirements and we’ll be pleased to provide a competitive quote.

AACC Clinical Lab Expo

This year’s AACC event will be held in our nations capitol Washington D.C. July 29 through July 31. It has been 17 years since the AACC last visited Washington D.C. so we expect this to be a banner event. We look forward to making many new contacts in this hot bed of the medical device and diagnostics industry. Please stop by our booth #209.